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US 12,700,686 B2Granted
Connector assembly for sensor device
AssigneeAnalog Devices, Inc.
InventorMichael J. Gardner
Life of this patent
Estimating the term…
Abstract
A connector assembly is disclosed. The connector assembly can include first and second connectors. The first connector can include a first electronic component mounted on a first component mount region of the first substrate. The second connector can include a second electronic component mounted on a second component mount region of the second substrate. The first connector and the second connector have different profiles from each other as seen from a top plan view, and can have wider middle portions that overlap when assembled. The first connector can be configured to connect to a sensor panel and a first external substrate or component. The second connector can be configured to connect to the sensor panel and a second external substrate or component.
Claims20
A connector assembly comprising:
- a first connector including a first substrate having conductive traces formed on or in the first substrate and a first electronic component mounted on a first component mount region of the first substrate, the conductive traces of the first connector comprising:
- a plurality of first traces and a plurality of second traces, the first electronic component positioned between the plurality of first traces and the plurality of second traces, the plurality of first traces configured to connect to a sensor panel and the plurality of second traces configured to connect to a first external substrate or component;
- and
- a second connector including a second substrate having conductive traces formed on or in the second substrate and a second electronic component mounted on a second component mount region of the second substrate, the conductive traces of the second connector comprising:
- a plurality of third traces and a plurality of fourth traces, the second electronic component positioned between the plurality of third traces and the plurality of fourth traces, the plurality of third traces configured to connect to the same sensor panel and the plurality of fourth traces configured to connect to a second external substrate or component,
- wherein the first connector and the second connector have different profiles from each other as seen from a top plan view,
- wherein the plurality of first traces and the plurality of third traces are configured to connect to adjacent portions of the sensor panel.
4 more elements
A sensor system comprising:
- a sensor panel;
- a circuit board coupled to the sensor panel;
- a first connector including a first substrate, a die mounted on a first die mount region of the first substrate, first input pins formed at a first input pin region of the first substrate and connected to the sensor panel, and first output pins formed at a first output pin region of the first substrate and connected to the circuit board, the first input pins and the first output pins spaced apart along a length of the first substrate, a width of the first input pin region being narrower than a width of the first die mount region;
- and
- a second connector including a second substrate, a die mounted on a second die mount region of the second substrate, second input pins formed at a second input pin region of the second substrate and connected to the sensor panel, and second output pins formed at a second output pin region of the second substrate and connected to the circuit board, the second input pins and the second output pins spaced apart along a length of the second substrate, a portion of the first die mount region overlapping a portion of the second die mount region,
- wherein the first input pins of the first connector and the second input pins of the second connector are positioned adjacent to each other.
3 more elements
A connector assembly comprising:
- a first connector including a first substrate having conductive traces formed on or in the first substrate and a first electronic component mounted on a first component mount region of the first substrate, the conductive traces of the first connector comprising:
- a plurality of first input traces and a plurality of first output traces, the first electronic component positioned between the plurality of first input traces and the plurality of first output traces, the plurality of first input traces configured to connect to a sensor panel and the plurality of first output traces configured to connect to a first external substrate or component;
- and
- a second connector including a second substrate having conductive traces formed on or in the second substrate and a second electronic component mounted on a second component mount region of the second substrate, the conductive traces of the second connector comprising:
- a plurality of second input traces and a plurality of second output traces, the second electronic component positioned between the plurality of second input traces and the plurality of second output traces, the plurality of second input traces configured to connect to the same sensor panel and the plurality of second output traces configured to connect to a second external substrate or component,
- wherein a length of the second connector is greater than a length of the first connector, the first substrate includes a first input pin region at ends of the first input traces, a width of the first input pin region being narrower than a width of the first component mount region, and
- wherein the plurality of first input traces and the plurality of second input traces are configured to connect to adjacent portions of the sensor panel.
4 more elements
Dependencies are inferred from the claim text.