Method for manufacturing electronic component
AssigneeShoei Chemical Inc.
InventorSoichiro Esaki
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AssigneeShoei Chemical Inc.
InventorSoichiro Esaki
Estimating the term…
A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.
A method for manufacturing an electronic component, comprising:
Dependencies are inferred from the claim text.