Electronic apparatus and manufacturing method thereof
AssigneeLenovo (Singapore) Pte. Ltd.
InventorsKenji Watamura, Seita Horikoshi, Tin-Lup Wong, Tabito Miyamoto, Yuichi Onda, Kazuo Fujii
Life of this patent
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Abstract
An electronic apparatus includes: a flat rectangular chassis that includes a side wall frame in which at least three side walls are formed by bending an extruded material, a first cover configured to form one surface of the chassis by being combined with the side wall frame, and a second cover configured to form another surface of the chassis by being combined with the side wall frame.
Claims7
An electronic apparatus comprising:
- a flat rectangular chassis that includes:
- a side wall frame in which at least three side walls are formed by bending an extruded material;
- a first cover configured to form one surface of the chassis by being combined with the side wall frame;
- and
- a second cover configured to form another surface of the chassis by being combined with the side wall frame, wherein
- the extruded material has a groove on a side,
- the side wall frame includes:
- a slide groove configured to be formed by the groove on a side of facing portions of the three side walls;
- and
- an engagement groove configured to be formed by the groove on a side of a central portion of the three side walls, and
- the second cover includes:
- an inward slide protrusion configured to be slidably engaged with the slide groove;
- and
- an inward engagement protrusion configured to be engaged with the engagement groove.
An electronic apparatus comprising:
- a flat rectangular chassis that includes:
- a side wall frame in which at least three side walls are formed by bending an extruded material;
- a first cover configured to form one surface of the chassis by being combined with the side wall frame;
- and
- a second cover configured to form another surface of the chassis by being combined with the side wall frame, wherein
- the extruded material includes:
- a first inner corner portion configured to position an edge of the first cover on one surface;
- and
- a second inner corner portion configured to position an edge of the second cover on another surface.
A manufacturing method of an electronic apparatus including a flat rectangular chassis, the manufacturing method comprising:
- obtaining a side wall frame by bending an extruded material to form at least three side walls,
- wherein
- the extruded material has a groove on a side,
- the side wall frame includes
- a slide groove configured to be formed by the groove on a side of facing portions of the three side walls, and
- an engagement groove configured to be formed by the groove on a side of a central portion of the three side walls;
- and
- attaching a first cover to one side of the side wall frame and attaching a second cover to the other side of the side wall frame, wherein
- an inward slide protrusion of the second cover is slidably engaged with the slide groove, and
- an inward engagement protrusion of the second cover is engaged with the engagement groove.
Dependencies are inferred from the claim text.