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US 12,699,331 B2Granted
Self-aligned ridge waveguide laser structure, method for fabrication, and method for use with interposer-based pics
OwnerSuresh Venkatesaninventor
Life of this patent
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Abstract
A structure and method for providing alignment aids that are co-fabricated with the optical emission output from a laser pedestal are described. In embodiments, the alignment aids are formed using processes and masking layers that produce a ridge waveguide laser structure. The use of same masking processes for the laser and the alignment aids provides lithographic level precision in the positioning of the alignment aids in relation to the optical output from the laser device. Optoelectrical die formed with the alignment aids may be used with complementary interposer structures to enable alignment of optical output from lasers formed on the optoelectrical die with optical devices on the interposer.
Claims20
A method for forming a die comprising a ridge laser structure, the method comprising
- concurrently forming a ridge laser emitting component of the ridge laser structure and two alignment features on a substrate,
- wherein the ridge laser emitting component comprises a quantum well layer for generating an optical signal,
- wherein a first alignment feature of the two alignment features comprises one or more first side surfaces for restricting movements of the die in a direction parallel to a lateral surface of the substrate and perpendicular to a propagation direction of the optical signal with the one or more first side surfaces disposed in a close proximity of one or more second side surfaces of an interposer when the die is mounted on the interposer,
- wherein a second alignment feature of the two alignment features comprises one or more exposed portions of the substrate, with the one or more exposed portions of the substrate configured to contact one or more top surfaces of the interposer, and with a first distance between at least an exposed portion of the one or more exposed portions and the optical signal being substantially the same as a second distance between at least a top surface of the one or more top surfaces and an optical pathway on the interposer,
- wherein the concurrently forming comprises depositing a ridge layer on a stack of layers,
- wherein the concurrently forming further comprises patterning the ridge layer to form a ridge element of the ridge laser emitting component and a top portion of the first alignment feature,
- wherein the concurrently forming further comprises patterning the stack of layers to form a bottom portion of the ridge laser emitting component comprising a quantum well and a bottom portion of the first alignment feature,
- wherein the concurrently forming further comprises patterning the stack of layers to expose the one or more exposed portions of the substrate.
5 more elements
A method for forming a die comprising a ridge laser structure, the method comprising
- concurrently forming a ridge laser emitting component of the ridge laser structure and two alignment features on a substrate,
- wherein the ridge laser emitting component comprises a quantum well layer for generating an optical signal,
- wherein a first alignment feature of the two alignment features comprises one or more first side surfaces for restricting movements of the die by the one or more first side surfaces disposed in a close proximity of one or more second side surfaces of an interposer when the die is mounted on the interposer,
- wherein a second alignment feature of the two alignment features comprises one or more exposed portions of the substrate, with the one or more exposed portions of the substrate configured to contact one or more top surfaces of the interposer, and with a first distance between at least an exposed portion of the one or more exposed portions and the optical signal being substantially the same as a second distance between at least a top surface of the one or more top surfaces and an optical pathway on the interposer,
- wherein the concurrently forming comprises depositing a ridge layer on a stack of layers on an etch stop layer,
- wherein the concurrently forming further comprises patterning the ridge layer to form a ridge element of the ridge laser emitting component and a top portion of the first alignment feature,
- wherein the concurrently forming further comprises patterning the stack of layers to form a bottom portion of the ridge laser emitting component comprising a quantum well and a bottom portion of the first alignment feature,
- wherein the concurrently forming further comprises patterning the stack of layers and the etch stop layer to expose the one or more exposed portions of the substrate,
- wherein the etch stop comprises a lower etch rate than that of the stack of layers,
- wherein the patterning the stack of layers comprises a different etch chemistry for the stack of layers as compared to the etch stop layer.
7 more elements
A method for forming a die comprising a ridge laser structure, the method comprising
- depositing a ridge layer on a stack of layers on an etch stop layer on a substrate, wherein the etch stop comprises a lower etch rate than that of the stack of layers,
- concurrently forming a ridge laser emitting component of the ridge laser structure and two alignment features on the substrate,
- wherein the ridge laser emitting component comprises a quantum well layer for generating an optical signal,
- wherein a first alignment feature of the two alignment features comprises one or more first side surfaces for restricting movements of the die by the one or more first side surfaces disposed in a close proximity of one or more second side surfaces of an interposer when the die is mounted on the interposer,
- wherein a second alignment feature of the two alignment features comprises one or more exposed portions of the substrate, with the one or more exposed portions of the substrate configured to contact one or more top surfaces of the interposer, and with a first distance between at least an exposed portion of the one or more exposed portions and the optical signal being substantially the same as a second distance between at least a top surface of the one or more top surfaces and an optical pathway on the interposer,
- wherein the concurrently forming comprises patterning the ridge layer to form a ridge element of the ridge laser emitting component and a top portion of the first alignment feature,
- wherein the concurrently forming further comprises patterning the stack of layers to form a bottom portion of the ridge laser emitting component comprising a quantum well and a bottom portion of the first alignment feature,
- wherein the concurrently forming further comprises patterning the stack of layers and the etch stop layer to expose the one or more exposed portions of the substrate,
- wherein the patterning the stack of layers comprises a different etch chemistry for the stack of layers as compared to the etch stop layer.
6 more elements
Dependencies are inferred from the claim text.