Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding process

An apparatus for applying an adhesive fluid onto a bonding surface during a die bonding process, the apparatus comprising:

• a positioning table,
• a dispensing device mounted on the positioning table and configured to be positionable by the positioning table to dispense the adhesive fluid onto the bonding surface,
• a stamping device mounted on the positioning table and configured to be positionable by the positioning table to stamp the adhesive fluid onto the bonding surface, wherein the dispensing device and stamping device are operative to apply the adhesive fluid onto different bonding positions on the bonding surface,
• a switching member that is mounted on the positioning table and coupled to the stamping device, which is configured to move the stamping device to a first standby position when the dispensing device is operated by the positioning table to dispense the adhesive fluid and to move the stamping device to a second standby position when the stamping device is operated by the positioning table to stamp the adhesive fluid, and
• a container coupled to or mounted on the positioning table for storing the adhesive fluid used by the stamping device, wherein the stamping device is further configured to be positionable by the positioning table to contact and receive the adhesive fluid from the container.