Method for manufacturing a thermo-optic component

A method of forming a thermo-optic component, the method comprising:

• providing a silicon-on-insulator (SOI) substrate including:
• a single-crystal silicon surface layer extending in a main plane;
• a dielectric layer;
• and
• a carrier substrate, wherein the dielectric layer is disposed between the single-crystal silicon surface layer and the carrier substrate, a surface of the carrier substrate defining at least one cavity extending into the carrier substrate adjacent the dielectric layer;
• forming an optical waveguide extending in the main plane and comprising a core in the single-crystal silicon surface layer, the optical waveguide surrounded by an optical confinement layer comprising the dielectric layer;
• and
• forming at least one heating element proximate the optical waveguide, the at least one heating element positioned, relative to the main plane, plumb with a segment of the optical waveguide, or on either side of the segment of the optical waveguide, the at least one heating element and the segment of the optical waveguide located plumb with the at least one cavity;
• after providing the SOI substrate including the single-crystal silicon surface layer, the dielectric layer, and the carrier substate with the surface of the carrier substrate defining at least one cavity, forming an aperture through the SOI substrate, the aperture extending to the at least one cavity;
• and
• altering a pressure within the at least one cavity.