Photonic integrated circuit chip
AssigneeWistron Corporation
InventorsChing Pao Sun, Cheng Hung Lu, Guan Fu Lu
Life of this patent
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AssigneeWistron Corporation
InventorsChing Pao Sun, Cheng Hung Lu, Guan Fu Lu
Estimating the term…
A photonic integrated circuit (PIC) chip has an empty area and includes a grating coupler array, a photodetector array, an optical modulator module, a plurality of optical waveguides, and a plurality of bonding pads. The photodetector array is configured to transform a light signal from the grating coupler array into an electrical signal. The optical modulator module is configured to modulate a light beam from the grating coupler array such that light with a specific wavelength in the light beam is output from the grating coupler array. The optical modulator module and the photodetector array are coupled with the grating coupler array through the optical waveguides. The bonding pads are electrically connected to the optical modulator module and the photodetector array. The grating coupler array, the photodetector array, the optical modulator module, the optical waveguides, and the bonding pads are disposed around the empty area.
A photonic integrated circuit chip, having an empty area, wherein the photonic integrated circuit chip comprises:
A photonic integrated circuit chip, having an empty area, wherein the photonic integrated circuit chip comprises:
Dependencies are inferred from the claim text.