Methods for welding an optical fiber to a photonic integrated circuit

A method for attaching an optical fiber to a photonic integrated circuit (PIC), the method comprising:

• providing the PIC;
• defining a groove in the PIC wherein the groove comprises an attachment surface configured to receive the optical fiber, wherein the attachment surface of the PIC comprises substantially the same material as an outer portion of the optical fiber;
• disposing a passivation layer of silicon dioxide on the attachment surface;
• disposing at least a portion of the outer portion of the optical fiber for receipt by the attachment surface;
• and
• heating an outer surface of the portion of the outer portion of the optical fiber and the attachment surface of the PIC to a melting point of the material to form a homogenous weld securing the optical fiber with respect to the attachment surface of the PIC.