Sealing member, fluid supplying device including sealing member, and substrate processing apparatus including fluid supplying device

A fluid supplying device connecting a fluid supplying pipe and an electrostatic chuck to each other, the fluid supplying device comprising:

• a fluid connection block having a fluid supplying hole connected to the fluid supplying pipe that supplies a fluid to the electrostatic chuck;
• and
• a sealing member mounted around the fluid supplying hole and sealing a space between the fluid connection block and the electrostatic chuck,
• wherein the sealing member comprises:
• a sealing jacket having a ring shape;
• an upper O-ring mounted on an upper surface of the sealing jacket;
• a lower O-ring mounted on a lower surface of the sealing jacket;
• and
• a pressure ring inserted into a receiving portion of the sealing jacket and configured to push the upper surface and the lower surface in opposite directions.

A substrate processing apparatus, comprising:

• an electrostatic chuck on which a substrate is mounted;
• a fluid supplying pipe supplying a fluid for controlling a temperature of the substrate to the electrostatic chuck;
• and
• a fluid supplying device connecting the fluid supplying pipe and the electrostatic chuck to each other,
• wherein the fluid supplying device comprises:
• a fluid connection block having a fluid supplying hole connected to the fluid supplying pipe that supplies the fluid to the electrostatic chuck;
• and
• a sealing member mounted around the fluid supplying hole and sealing a space between the fluid connection block and the electrostatic chuck, and
• wherein the sealing member comprises:
• a sealing jacket having a ring shape;
• an upper O-ring mounted on an upper surface of the sealing jacket;
• a lower O-ring mounted on a lower surface of the sealing jacket;
• and
• a pressure ring inserted into a receiving portion of the sealing jacket and configured to push the upper surface and the lower surface in opposite directions.