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US 12,698,425 B2Granted
Hot melt adhesive
AssigneeHenkel AG & Co. KGaA
InventorAi Takamori
Life of this patent
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Abstract
Disclosed is a hot melt adhesive comprising: (A) a copolymer of ethylene with an olefin having 3 to 20 carbon atoms; (B) a copolymer of ethylene with a carboxylic acid derivative having an ethylenic double bond; and (C) a tackifying resin, wherein the (B) copolymer of ethylene with a carboxylic acid derivative having an ethylenic double bond comprises (B1) a copolymer of ethylene with a (meth)acrylic acid derivative, which copolymer (B1) has a melt flow rate of 1 to 38 g/10 min.
Claims14
A hot melt adhesive composition comprising:
- a copolymer of ethylene and an olefin, the olefin having 3 to 20 carbon atoms;
- a copolymer of ethylene and a carboxylic acid derivative having an ethylenic double bond;
- a tackifying resin;
- and
- a wax, wherein:
- the copolymer of ethylene and the carboxylic acid derivative comprises a copolymer of ethylene and a (meth)acrylic acid derivative, the copolymer of ethylene and the (meth)acrylic acid derivative having a melt flow rate of from 1 to 8 g/10 min, measured at 190° C. with a 2.16 kg load in accordance with JIS K7210,
- the copolymer of ethylene and the olefin is present in an amount of from 20 to 50 parts by mass, based on 100 parts by total mass of the copolymer of ethylene and the olefin, the copolymer of ethylene and the carboxylic acid derivative, and the tackifying resin, and
- the tackifying resin is present in an amount of from 40 to 55 parts by mass, based on 100 parts by total mass of the copolymer of ethylene and the olefin, the copolymer of ethylene and the carboxylic acid derivative, and the tackifying resin.
5 more elements
Dependencies are inferred from the claim text.