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US 12,697,814 B2Granted
Head module
AssigneeBrother Kogyo Kabushiki Kaisha
InventorsItsuki Morimoto, Yuki Kawamura
Life of this patent
Estimating the term…
Abstract
A head module includes: a head chip having an actuator, a channel member having a channel deformable by the actuator, and a support made of metal and supporting the channel member, a heater assembly; and a heat conductor. The heat conductor has a first contacting part in thermal contact with the support, and a second contacting part in thermal contact with the heater assembly and the actuator.
Claims10
A head module, comprising:
- a head chip having an actuator, a channel member having a channel deformable by the actuator, and a support made of metal, the support being in direct contact with the channel member and supporting the channel member;
- a heater assembly;
- and
- a heat conductor,
- wherein the heat conductor has a first contacting part in thermal contact with the support, and a second contacting part in thermal contact with the heater assembly and the actuator.
2 more elements
Dependencies are inferred from the claim text.