LED support, preparation method thereof, and device

A light-emitting diode (LED) support, comprising:

• a substrate provided with a conductive through hole;
• an inner electrode disposed on a front of the substrate and connected to the conductive through hole;
• a heat dissipation pad disposed on a back of the substrate;
• an electrode pad disposed on the back of the substrate and separated from the heat dissipation pad, wherein the electrode pad comprises a top connection layer and a bottom electrode layer that are laminated, the top connection layer is connected to the back of the substrate and is provided with a connection portion, the connection portion extends toward the heat dissipation pad, is connected to the conductive through hole, and is located between the bottom electrode layer and the heat dissipation pad, and a spacing between the bottom electrode layer and the heat dissipation pad is greater than a spacing between the connection portion and the heat dissipation pad;
• and
• a solder resist layer, which is filled in a groove formed between the electrode pad and the heat dissipation pad on the back of the substrate, and covers the connection portion.