Flexible circuit board and display module
AssigneesChengdu Boe Optoelectronics Technology Co., Ltd., Boe Technology Group Co., Ltd.
InventorsJiahua Wang, Hao Cheng, Jianjun Wu, Qiang Fan, Xin Bi, Jingchang Su, Wen Huang
Life of this patent
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Abstract
A flexible circuit board and a display module are provided. The flexible circuit board includes: a flexible substrate having a chip binding region; a driving chip, arranged in the chip binding region of the flexible substrate; and a protective layer, arranged on a side of the driving chip away from the flexible substrate, where the protective layer includes an electrostatic discharge layer, an orthographic projection of the electrostatic discharge layer on the flexible substrate at least partially overlaps with an orthographic projection of the driving chip on the flexible substrate.
Claims19
A flexible circuit board, comprising:
- a flexible substrate having a chip binding region;
- a driving chip, arranged in the chip binding region of the flexible substrate;
- and
- a protective layer, arranged on a side of the driving chip away from the flexible substrate, wherein the protective layer comprises an electrostatic discharge layer, an orthographic projection of the electrostatic discharge layer on the flexible substrate at least partially overlaps with an orthographic projection of the driving chip on the flexible substrate;
- wherein the electrostatic discharge layer is provided with a first surface close to the flexible substrate, a second surface far away from the flexible substrate, and a plurality of electrostatic discharge graphic units, each of the plurality of the electrostatic discharge graphic units comprises at least two electrostatic discharge sharp corners, and a discharge channel is defined between the electrostatic discharge sharp corners and runs through the first surface and the second surface.
A display module, comprising a display panel, a circuit board and a flexible circuit board, wherein the flexible circuit board comprises:
- a flexible substrate having a chip binding region;
- a driving chip, arranged in the chip binding region of the flexible substrate;
- and
- a protective layer, arranged on a side of the driving chip away from the flexible substrate, wherein the protective layer comprises an electrostatic discharge layer, an orthographic projection of the electrostatic discharge layer on the flexible substrate at least partially overlaps with an orthographic projection of the driving chip on the flexible substrate;
- wherein the electrostatic discharge layer is provided with a first surface close to the flexible substrate, a second surface far away from the flexible substrate, and a plurality of electrostatic discharge graphic units, each of the plurality of the electrostatic discharge graphic units comprises at least two electrostatic discharge sharp corners, and a discharge channel is defined between the electrostatic discharge sharp corners and runs through the first surface and the second surface.
A display module, comprising a display panel, a circuit board and a flexible circuit board;
- wherein the flexible circuit board comprises:
- a flexible substrate having a chip binding region;
- a driving chip, arranged in the chip binding region of the flexible substrate;
- and
- a protective layer, arranged on a side of the driving chip away from the flexible substrate, wherein the protective layer comprises an electrostatic discharge layer, an orthographic projection of the electrostatic discharge layer on the flexible substrate at least partially overlaps with an orthographic projection of the driving chip on the flexible substrate;
- wherein the flexible substrate comprises:
- a base substrate;
- a conductive layer, arranged on a side of the base substrate close to the protective layer;
- wherein the conductive layer comprises a first pin and a second pin connected to each other, the first pin is grounded, and the second pin is configured to be connected to the electrostatic discharge layer;
- and
- an insulating film, arranged on a side of the conductive layer away from the base substrate, wherein the insulating film is located on a periphery of the driving chip;
- wherein the first pin is connected to the circuit board, and the circuit board is provided with a ground end;
- the conductive layer further comprises a third pin connected to the display panel.
Dependencies are inferred from the claim text.