Wire coating removal device and wire forming system
AssigneeAsahi-Seiki Manufacturing Co., Ltd.
InventorsEiji Obayashi, Takashi Nojima, Ryota Fukatsu
Life of this patent
Estimating the term…
Loading patent…
AssigneeAsahi-Seiki Manufacturing Co., Ltd.
InventorsEiji Obayashi, Takashi Nojima, Ryota Fukatsu
Estimating the term…
A wire coating removal device includes: a wire feed path; a pair of first rotary tools that remove a coating of the wire at a first position on the wire feed path; a first rotary drive mechanism that rotationally drives the pair of first rotary tools; a pair of second rotary tools that remove the coating of the wire at a second position; a second rotary drive mechanism that rotationally drives the pair of second rotary tools; a first tool distance changing mechanism that makes the pair of first rotary tools approach or separates from each other; and a second tool distance changing mechanism that makes the pair of second rotary tools approach or separates from each other, wherein the pair of first rotary tools remove a part of the coating of the wire, and the pair of second rotary tools then remove a remainder of the coating.
A wire coating removal device comprising:
Dependencies are inferred from the claim text.