Laser device

A laser device, comprising:

• a case;
• at least one heat sink located in the case, each heat sink including a heat dissipation substrate, a heat dissipation layer, an auxiliary layer and a conductive layer that are disposed in sequence along a direction away from the case;
• a plurality of laser chips located on a side of the at least one heat sink away from the case, each heat sink corresponding to one or more laser chips;
• and
• at least one prism located in the case, the at least one heat sink corresponding to the at least one prism, each prism corresponding to one or more laser chips, each prism being located on a light-emitting side of corresponding one or more laser chips, and each prism being configured to reflect a beam of light emitted by the corresponding one or more laser chips;
• wherein at least one laser chip among the plurality of laser chips includes a first end that extends beyond a second end of the heat sink where the at least one laser chip is located, wherein
• the first end is an end of the at least one laser chip proximate to a prism corresponding to the at least one laser chip, and the second end is an end of the heat sink where the at least one laser chip is located proximate to the prism corresponding to the at least one laser chip;
• and
• a length by which the first end the at least one laser chip extends beyond the second end of the heat sink where the laser chip is located is less than or equal to 15 m;
• and
• wherein in the heat sink where the at least one laser chip is located, ends of the heat dissipation layer, the auxiliary layer and the conductive layer that are away from the prism corresponding to the at least one laser chip, are flush with each other and an end of the heat dissipation substrate away from the prism corresponding to the at least one laser chip, extends beyond the ends of the heat dissipation layer, the auxiliary layer and the conductive layer that are away from the prism corresponding to the at least one laser chip.