Preparation method for electronic device and millimeter wave antenna
AssigneesBeijing BOE Technology Development Co., Ltd., Boe Technology Group Co., Ltd.
InventorsYafei Zhang, Xudong Zhang, Dongdong Zhang, Mengwen Jia, Mengxia Yu
Life of this patent
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Abstract
Provided are a millimeter wave antenna and a preparation method thereof, an electronic device and a driving method thereof, relating to the field of display technology. The preparation method of the millimeter wave antenna includes: providing a first baseboard; forming a definition layer on the first baseboard; treating the definition layer to enable the definition layer to have a plurality of through holes; forming an electrode layer in each of the through holes of the definition layer; the electrode layer includes a radiation pattern and a feeder, and both the radiation pattern and the feeder include a mesh structure.
Claims14
A method for preparing a millimeter wave antenna, comprising:
- providing a first baseboard;
- forming a definition layer on the first baseboard;
- treating the definition layer to enable the definition layer to have a plurality of through holes;
- and
- forming an electrode layer in each of the through holes of the definition layer;
- wherein the electrode layer comprises a radiation pattern and a feeder, and both of the radiation pattern and the feeder comprise a mesh structure;
- wherein the forming a definition layer on the first baseboard comprises:
- forming at least a first planarization layer on the first baseboard;
- the treating the definition layer to enable the definition layer to have a plurality of through holes comprises:
- treating at least the first planarization layer to enable the first planarization layer to have a plurality of through holes;
- the forming an electrode layer in each of the through holes of the definition layer comprises:
- forming the electrode layer at least in each of the through holes of the first planarization layer;
- wherein the forming at least a first planarization layer on the first baseboard comprises:
- forming a first buffer layer on the first baseboard;
- forming the first planarization layer on the first buffer layer;
- and
- forming a mask layer on the first planarization layer;
- the treating at least the first planarization layer to enable the first planarization layer to have a plurality of through holes comprises:
- treating at least two of the first buffer layer, the first planarization layer and the mask layer simultaneously to enable all of the first buffer layer, the first planarization layer and the mask layer to have a plurality of through holes;
- the forming the electrode layer at least in each of the through holes of the first planarization layer comprises:
- forming the electrode layer at least in each of the through holes of the first buffer layer and in each of the through holes of the first planarization layer.
A millimeter wave antenna, comprising:
- a first baseboard;
- a definition layer, disposed on the first baseboard and comprising a plurality of through holes;
- and
- an electrode layer disposed in each of the through holes of the definition layer, wherein the electrode layer comprises a radiation pattern and a feeder, and both of the radiation pattern and the feeder comprise a mesh structure;
- wherein the definition layer comprises at least a first planarization layer;
- the first planarization layer comprises a plurality of through holes, and the electrode layer is at least disposed in each of the through holes of the first planarization layer;
- wherein the definition layer further comprises a first buffer layer and a mask layer, wherein the first buffer layer is disposed between the first baseboard and the first planarization layer, and the mask layer is disposed on a side of the first planarization layer facing away from the first baseboard;
- all of the first buffer layer, the first planarization layer and the mask layer have a plurality of through holes, and the electrode layer is disposed in each of the through holes of the mask layer, in each of the through holes of the first planarization layer, and in each of the through holes of the first buffer layer;
- or
- wherein the definition layer further comprises a first buffer layer disposed between the first baseboard and the first planarization layer;
- both of the first buffer layer and the first planarization layer comprise a plurality of through holes, and the electrode layer is disposed in each of the through holes of the first planarization layer and in each of the through holes of the first buffer layer.
Dependencies are inferred from the claim text.