Microelectronic device package with integral slotted waveguide antenna
AssigneeTexas Instruments Incorporated
InventorsYiqi Tang, Rajen Murugan, Harshpreet Singh Phull Bakshi, Sylvester Ankamah-Kusi, Juan Herbsommer, Aditya Nitin Jogalekar
Life of this patent
Estimating the term…
Abstract
An example microelectronic device package includes: a multilayer package substrate including a slotted waveguide antenna and having routing conductors, the multilayer package substrate having a device side surface and an opposing board side surface; a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to slotted waveguide antenna by the routing conductors; and mold compound covering the semiconductor die, and a portion of the multilayer package substrate.
Claims26
A microelectronic device package, comprising:
- a multilayer package substrate comprising a slotted waveguide antenna and routing conductors, the multilayer package substrate having a device side surface and an opposing board side surface;
- a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to the slotted waveguide antenna by the routing conductors;
- and
- mold compound covering the semiconductor die, and a portion of the multilayer package substrate.
An apparatus, comprising:
- a multilayer package substrate comprising an array of slotted waveguide antennas positioned side by side and routing conductors, the multilayer package substrate having a device side surface and an opposite board side surface;
- a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to the array of slotted waveguide antennas by the routing conductors;
- and
- a cover covering the semiconductor die, and a portion of the multilayer package substrate.
A method, comprising:
- forming a multilayer package substrate comprising a slotted waveguide antenna and routing conductors in trace level conductors of the multilayer package substrate;
- mounting a semiconductor die over a device side surface of the multilayer package substrate, the semiconductor die coupled to the slotted waveguide antenna by the routing conductors;
- and
- covering the semiconductor die and a portion of the multilayer package substrate with mold compound to form a microelectronic device package.
Dependencies are inferred from the claim text.