Microelectronic device package with integrated antenna
AssigneeTexas Instruments Incorporated
InventorJuan Alejandro Herbsommer
Life of this patent
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Abstract
A described example includes: a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having bond pads on a device side surface facing away from the die pad; bond wires coupling the bond pads of the semiconductor die to leads of the package substrate, the leads spaced from the die pad; an antenna positioned over the device side surface of the semiconductor die and having a feed line coupled between the antenna and a device side surface of the semiconductor die; and mold compound covering the semiconductor die, the bond wires, a portion of the leads, and the die side surface of the die pad, a portion of the antenna exposed from the mold compound.
Claims18
An apparatus, comprising:
- a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having a bond pad on a device side surface facing away from the die pad;
- a bond wire coupling the bond pad to a lead of the package substrate, the lead spaced from the die pad;
- an antenna including a first conductor and a first feed line, a portion of the first feed line coupled to the device side surface of the semiconductor die;
- and
- mold compound covering portions of the semiconductor die, the bond wire, the lead, and the antenna, wherein a surface of the first conductor is exposed on a surface of the mold compound.
An apparatus, comprising:
- a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having a bond pad on a device side surface facing away from the die pad;
- a bond wire coupling the bond pad to a lead of the package substrate, the lead spaced from the die pad;
- an antenna including a first conductor coupled to a first feed line, and a second conductor coupled to a second feed line, a portion of the first feed line coupled to the device side surface of the semiconductor die, and a portion of the second feed line coupled to the device side surface of the semiconductor;
- and
- mold compound covering portions of the semiconductor die, the bond wire, the lead, and the antenna, wherein a surface of the first conductor and a surface of the second conductor are exposed from the mold compound, and wherein a surface of the first feed line and a surface of the second feed line are exposed from the mold compound.
Dependencies are inferred from the claim text.