Dynamic memory operations

A device in a package communicably coupled to a stacked dynamic random-access memory (DRAM) in the package and one or more memory monitors, the device comprising:

• a controller to interface with the stacked DRAM;
• and
• a system manager implemented on a processor chip in the package configured to:
• receive conditions of the stacked DRAM detected by the one or more memory monitors;
• and
• interface with one or more systems to dynamically adjust at least one of a voltage or a frequency for operating individual DRAM die of the stacked DRAM based on the received conditions.

A method comprising:

• detecting, by one or more memory monitors, conditions of a stacked dynamic random-access memory (DRAM) in a package;
• interfacing, by a controller in the package, with the stacked DRAM;
• receiving, by a system manager in the package, the detected conditions of the stacked DRAM from the one or more memory monitors;
• and
• interfacing, by the system manager in the package, with one or more systems to dynamically adjust at least one of a voltage or a frequency for operating individual DRAM die of the stacked DRAM based on the detected conditions.