Method and apparatus for controlling droplet in extreme ultraviolet light source
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChi-Hung Liao, Yueh-Lin Yang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChi-Hung Liao, Yueh-Lin Yang
Estimating the term…
A lithography method in semiconductor fabrication is provided. The method includes generating a plurality of first drops of a target material through a first nozzle group selected from a plurality of nozzles to form a first elongated droplet; generating a first laser pulse to convert the first elongated droplet into plasma that generates a first extreme ultraviolet (EUV) radiation; reflecting the first EUV radiation by a collector mirror having an optical axis; generating a plurality of second drops of the target material through a second nozzle group selected from the plurality of nozzles to form a second elongated droplet, the second elongated droplet being oblique with the optical axis of the collector mirror at a different angle than the first elongated droplet.
A lithography method in semiconductor fabrication, comprising:
A lithography method in semiconductor fabrication, comprising:
A lithography method in semiconductor fabrication, comprising:
Dependencies are inferred from the claim text.