Photonic package and method for forming the same

A method for forming a photonic package, comprising:

• receiving a substrate having a first region and a second region;
• forming a plurality of first insulating segments in the first region;
• forming a plurality of second insulating segments in the second region;
• forming a semiconductor structure coupled to top surfaces of the second insulating segments, wherein the second insulating segments are separated from each other by the semiconductor structure;
• forming an insulating layer over the semiconductor structure and the first insulating segments, wherein a bottom surface of the insulating layer is coupled to a top surface of the semiconductor structure and top surfaces of the first insulating segments;
• forming at least a photonic component in the substrate.

A method for forming a photonic package, comprising:

• receiving a substrate having a first region and a second region;
• forming a plurality of first insulating segments in the first region;
• forming a plurality of second insulating segments in the second region, wherein top surfaces of the first insulating segments are higher than top surfaces of the second insulating segments, and bottom surfaces of the first insulating segments are lower than the top surfaces of the second insulating segments;
• forming a semiconductor structure covering the second insulating segments, wherein the top surfaces of the first insulating segments are aligned with a top surface of the semiconductor structure;
• forming at least a photonic component in the substrate.