Curable silicone composition, cured product of same, and method for producing same

A curable silicone composition that is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower, comprising:

• (A1) an organopolysiloxane resin component having no hot-melt properties as a whole molecule and where 20 mol % or more of the total siloxane units of the organopolysiloxane resin component is siloxane units represented by SiO4/2, wherein “no hot-melt properties” means that component (A1), alone, does not exhibit heat melting behavior at a temperature of 200° C. or lower, and does not have a softening point and melt viscosity;
• (A2) a straight- or branched-chain organopolysiloxane, liquid at 25° C., having at least two curing-reactive functional groups containing a carbon-carbon double bond in the molecule;
• (B) one or more adhesion promoters selected from silatrane derivatives and carbasilatrane derivatives;
• (C) a curing agent;
• and
• (D) functional inorganic filler;
• wherein the content of component (D) is 10% or more by volume relative to the entire composition;
• and
• wherein “has hot-melt properties” means having a softening point of 50° C. or higher, and, at 150° C., having melt viscosity of less than 1,000 Pa·s, and having flowing properties;
• and
• wherein “softening point” means the temperature at which the deformation amount in the height direction is 1 mm or more, and the melt viscosity is measured using a Koka-type flow tester.