Thermally conductive silicone adhesive composition and a thermally conductive composite

A thermally conductive silicone adhesive composition, comprising the following components (a) to (e):

• (a) 100 parts by mass of a linear or branched organopolysiloxane;
• (b) 1,500 to 7,500 parts by mass of a thermally conductive filler;
• (c) 150 to 600 parts by mass of an organopolysiloxane resin with three-dimensional network structure, comprising the following components (c-1) and (c-2);
• (c-1) an organopolysiloxane resin with three-dimensional network structure, represented by the following general formula (1):
• wherein R1 is, independently of each other, a group selected from the group consisting of alkyl groups having 1 to 10 carbon atoms, aryl groups having 6 to 10 carbon atoms, and aralkyl groups having 7 to 10 carbon atoms, R2 is an alkenyl group having 2 to 8 carbon atoms, and a1, b1, c1, d1 and e1 are numbers each satisfying equations 0<a1<=100, 0<b1<=100, 0<=c1<=100, 0<=d1<=100, 0<=e1<=100, 0<d1+e1, and 0.5<=al/(d1+e1)<=2,
• wherein an amount of alkenyl groups in the molecule is 0.05 to 0.15 mol/100 g;
• (c-2) an organopolysiloxane with three-dimensional network structure resin, represented by the following general formula (2):
• wherein R1 is, independently of each other, a group selected from the group consisting of alkyl groups having 1 to 10 carbon atoms, aryl groups having 6 to 10 carbon atoms, and aralkyl groups having 7 to 10 carbon atoms, and a2, c2, d2 and e2 are numbers each satisfying equations 0<a2<=100, 0<=c2<=100, 0<=d2<=100, 0<e2<=100, and 0.7<=a2/e2<=2.5;
• (d) 1 to 25 parts by mass of an organohydrogenpolysiloxane having two or more hydrosilyl groups in one molecule;
• and
• (e) 5 to 50 parts by mass of an organic peroxide.