Back to results
US 12,692,413 B2Granted
Polishing compositions and methods of use thereof
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsCarl Ballesteros, Hyosang Lee
Life of this patent
Estimating the term…
Abstract
This disclosure relates to polishing compositions containing at least one abrasive, at least one organic photocatalyst, and water.
Claims19
A polishing composition, comprising:
- at least one abrasive;
- at least one organic photocatalyst, wherein the organic photocatalyst is a helical carbenium ion containing compound;
- and
- water.
1 more element
Dependencies are inferred from the claim text.