Substrate for heat-resistant electronic device
AssigneeLG Chem, Ltd.
InventorsYoungsun Park, Shinji Shiraki
Life of this patent
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Abstract
The present disclosure proposes an improved heat resistant base for electronic equipment having transparency, heat resistance and mechanical strength and also having superior optical properties and quality, and thereby capable of replacing a transparent glass base. The present disclosure is accomplished by the heat resistant base for electronic equipment including a polyimide-based resin and a hollow particle, wherein a plurality of the hollow particles are dispersed and present in the polyimide-based resin, and the hollow particle has an average particle diameter of greater than or equal to 10 nm and less than or equal to 300 nm.
Claims13
A heat resistant base for electronic equipment, the base comprising:
- a polyimide-based resin;
- and
- hollow particles,
- wherein the hollow particles are dispersed in the polyimide-based resin;
- and
- the hollow particles have an average particle diameter of greater than or equal to 10 nm and less than or equal to 300 nm,
- wherein the hollow particles are hollow silica particles, and the hollow silica particles are surface treated with a fluorine-based compound, and
- wherein the hollow silica particles are included in an amount of greater than 30% by weight and less than 60% by weight with respect to the total weight of the heat resistant base, and
- the polyimide-based resin has a refractive index of greater than or equal to 1.40 and less than or equal to 1.55 at a wavelength of 632.8 nm after curing.
Dependencies are inferred from the claim text.