Control module for high power motor

A control module comprising:

• a mounting frame made up of thermally-conductive material and comprising a bottom wall and four side walls projecting from the bottom wall;
• a circuit board disposed within the four side walls of the mounting frame;
• a plurality of power switches configured as an inverter circuit, the plurality of power switches comprising:
• a first array of power switches mounted on a first surface of the circuit board, and a second array of power switches mounted on a second surface of the circuit board opposite the first array of power switches;
• a plurality of power output posts extending perpendicularly from the first surface of the circuit board proximate the first array of power switches and oriented along an axis that is substantially parallel to the first array of power switches;
• a first heat sink disposed above the circuit board and in thermal contact with the first array of power switches;
• and
• a second heat sink mounted on the bottom wall of the mounting frame below the circuit board and in thermal contact with the second array of power switches,
• wherein the first heat sink and the second heat sink are secured to one another via a plurality of fasteners passing through the circuit board and the first heat sink includes at least one circumferential rib arranged to penetrate into a space between the respective plurality of power output posts.

A control module comprising:

• a mounting frame made up of thermally-conductive material and comprising a bottom wall and four side walls projecting from the bottom wall;
• a circuit board disposed within the four side walls of the mounting frame;
• a plurality of power switches configured as an inverter circuit, the plurality of power switches comprising:
• a first array of power switches mounted on a first surface of the circuit board, and a second array of power switches mounted on a second surface of the circuit board opposite the first array of power switches;
• a first heat sink disposed above the circuit board and in thermal contact with the first array of power switches;
• a second heat sink mounted on the bottom wall of the mounting frame below the circuit board and in thermal contact with the second array of power switches;
• and
• two power input posts mounted on a top surface of the circuit board adjacent an auxiliary board, wherein the two power input posts receive electric power from a power source and are coupled to the inverter circuit,
• wherein the first heat sink includes recessed portions arranged to accommodate the two power input posts and the first heat sink and the second heat sink are secured to one another via a plurality of fasteners passing through the circuit board.