Method for discriminating wafer region and wafer region discrimination apparatus for performing the same
AssigneeKctech Co., Ltd.
InventorHo Kyun Lim
Life of this patent
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Abstract
A method of discrimination a wafer region and a wafer region discrimination apparatus performing the same are disclosed. A wafer region discrimination apparatus includes a probe including an optical sensor and configured to obtain optical spectrum signals of which signal values vary based on a thickness characteristic of a wafer at a plurality of positions on the wafer and a processor configured to identify whether a current optical spectrum signal is obtained from a die region on the wafer in which a chip is disposed using a region discrimination model based on a neural network that uses the current optical spectrum signal obtained by the probe as an input.
Claims15
A wafer region discrimination apparatus comprising:
- a probe comprising an optical sensor and configured to obtain optical spectrum signals of which signal values vary based on a thickness characteristic of a wafer at a plurality of positions on the wafer;
- and
- a processor configured to identify whether a current optical spectrum signal obtained by the probe is obtained from a die region on the wafer in which a chip is disposed or from a non-die region on the wafer in which the chip is not disposed using a region discrimination model based on a neural network that uses the current optical spectrum signal obtained by the probe as an input, wherein the region discrimination model is trained using training data which include optical spectrum signals corresponding to the die region of the wafer and optical spectrum signals corresponding to the non-die region of the wafer.
A method of discriminating a wafer region, the method comprising:
- obtaining optical spectrum signals of which signal values vary based on a thickness characteristic of a wafer at a plurality of positions on the wafer through a probe;
- and
- identifying whether a current optical spectrum signal obtained by the probe is obtained from a die region on the wafer in which a chip is disposed or from a non-die region on the wafer in which the chip is not disposed using a region discrimination model based on a neural network that uses the current optical spectrum signal obtained by the probe as an input, wherein the region discrimination model is trained using training data which include optical spectrum signals corresponding to the die region of the wafer and optical spectrum signals corresponding to the non-die region of the wafer.
Dependencies are inferred from the claim text.