Processing method and processing apparatus for workpiece
AssigneeDisco Corporation
InventorsKeiichiro Niitsu, Youngsuk Kim, Koji Watanabe
Life of this patent
Estimating the term…
Abstract
Disclosed is a processing method for a workpiece. The processing method includes a holding step of holding the workpiece on a holding table, a grinding step of grinding the workpiece that is held on the holding table at and around its center by a grinding wheel, so that a recess portion is formed at and around the center of the workpiece and an annular projection portion is formed surrounding the recess portion at and along an outer periphery of the workpiece, and a fusion step of applying a laser beam to a surface of the workpiece, the surface having been ground in the grinding step, so that the ground surface is fused. A processing apparatus for a workpiece is also disclosed.
Claims5
A processing method for a workpiece, comprising:
- a holding step of holding the workpiece on a holding table;
- a grinding step of grinding the workpiece that is held on the holding table at and around a center thereof by a grinding wheel, so that a recess portion is formed at and around the center of the workpiece, an annular projection portion is formed surrounding the recess portion at and along an outer periphery of the workpiece, and an inner side surface is formed between the recess portion and the annular projection portion;
- and
- a fusion step of applying a laser beam to a boundary region including the inner side surface and a bottom surface of the recess portion, so that the boundary region is fused.
Dependencies are inferred from the claim text.