Microfluidic substrate, microfluidic chip and manufacturing method thereof

A method for manufacturing a microfluidic chip, comprising:

• providing a first substrate;
• forming a wiring on the first substrate;
• forming a passivation layer comprising a through hole on the wiring;
• forming a conductive layer on the passivation layer and patterning the conductive layer;
• forming a defining layer on a side of the conductive layer facing away from the first substrate, the defining layer defining a concave portion, the conductive layer comprising a plurality of conductive patterns corresponding to the concave portion, the plurality of conductive patterns being arranged along a first direction, each conductive pattern extending along a second direction and comprising a first end and a second end, the first direction being perpendicular to the second direction, each conductive pattern having a maximum local resistance value at the first end and the second end of the conductive pattern, and the conductive layer being electrically connected to the wiring via the through hole;
• arranging a sealant on the periphery of the concave portion, the sealant defining a chamber;
• and
• arranging a counter substrate on a side of the defining layer facing away from the first substrate.