Chip packaging structure and chip packaging method

A chip packaging method, applied to a chip packaging structure, the chip packaging structure comprises:

• a sample substrate with a plurality of through holes therein penetrating through the sample substrate along a thickness direction of the sample substrate;
• a first cover plate and a second cover plate respectively on two opposite sides of the sample substrate along the thickness direction of the sample substrate and attached to the sample substrate;
• and at least one pair of a sample inlet and a sample outlet, each pair of the sample inlet and the sample outlet being in one of the first cover plate and the second cover plate or in the first cover plate and the second cover plate, respectively, and a flow path being between each pair of the sample inlet and the sample outlet, wherein a first flow channel structure is on a surface of the first cover plate opposite to the sample substrate, a second flow channel structure is on a surface of the second cover plate opposite to the sample substrate, and the first flow channel structure and the second flow channel structure are connected together with the plurality of through holes, to form a continuous channel corresponding to the flow path between each pair of the sample inlet and the sample outlet,
• the method comprises:
• injecting a sample through each sample inlet until the sample fully fills the continuous channel along the flow path and flows out from each sample outlet;
• peeling off one of the first cover plate and the second cover plate from the sample substrate;
• attaching a sealing cover plate to a surface of the sample substrate, to which one of the first cover plate and the second cover plate is previously attached, a sealing groove being provided in the sealing cover plate, and an orthographic projection of the sealing groove on a plane parallel to the sample substrate completely covering an orthographic projection of all the through holes on the plane parallel to the sample substrate, and an inlet and an outlet being provided in the sealing cover plate and communicated with the sealing groove;
• injecting a sealing medium into the sealing groove through the inlet until the sealing medium fully fills the sealing groove and flows out from the outlet;
• blocking the inlet and the outlet, and then turning over the chip packaging structure by 180°;
• peeling off the other of the first cover plate and the second cover plate from the sample substrate;
• attaching another sealing cover plate to a surface of the sample substrate to which the other of the first cover plate and the second cover plate is previously attached;
• injecting a sealing medium into a sealing groove from an inlet of the another sealing cover plate until the sealing medium fully fills the sealing groove and flows out from an outlet;
• and
• blocking the inlet and the outlet of the another sealing cover plate.

A chip packaging structure, comprising:

• a sample substrate with a plurality of through holes therein penetrating through the sample substrate along a thickness direction of the sample substrate;
• a first cover plate and a second cover plate respectively on two opposite sides of the sample substrate along the thickness direction of the sample substrate and attached to the sample substrate;
• and
• at least one pair of a sample inlet and a sample outlet, each pair of the sample inlet and the sample outlet being in one of the first cover plate and the second cover plate or in the first cover plate and the second cover plate, respectively, and a flow path being between each pair of the sample inlet and the sample outlet,
• wherein a first flow channel structure is on a surface of the first cover plate opposite to the sample substrate, a second flow channel structure is on a surface of the second cover plate opposite to the sample substrate, and the first flow channel structure and the second flow channel structure are connected together with the plurality of through holes, to form a continuous channel corresponding to the flow path between each pair of the sample inlet and the sample outlet,
• wherein a plurality of sample substrates are included and sequentially attached to each other in a direction from the first cover plate to the second cover plate, each sample substrate comprises a through hole region and a non-through hole region, and each through hole is in the through hole region;
• and
• every two adjacent sample substrates are slidable with respect to each other, so that through holes in one of the two adjacent sample substrates are in the through hole region of the other sample substrate and coincide with corresponding through holes in the other sample substrate;
• or, the through holes in one of the two adjacent sample substrates are in the non-through hole region of the other sample substrate and isolated from the through holes in the other sample substrate.