GaN-based trench metal oxide Schottky barrier diode and preparation method therefor
AssigneeSun Yat-Sen University
InventorsYang Liu, Yuhao Zhou
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AssigneeSun Yat-Sen University
InventorsYang Liu, Yuhao Zhou
Estimating the term…
The invention relates to a GaN-based trench metal oxide Schottky barrier diode and a preparation method therefor. The device structure from bottom to top includes: an ohmic contact metal layer covering a substrate i.e., cathode; a GaN self-supporting substrate; an n-type lightly doped epitaxial layer; a p-type high-concentration GaN layer arranged in parallel; a dielectric layer in the trench; a metal layer convering the upper surface of the device i.e., the anode. The p-type high-concentration GaN layer with high carrier concentration can be obtained by using a selective area epitaxial method to form the p-type high-concentration GaN layer. Then the dielectric layer is deposited, and a contact hole is provided on the dielectric layer, subsequently the anode metal is connected to the p-type high-concentration GaN layer through the contact hole, forming the ohmic contact.
A GaN-based trench metal oxide Schottky barrier diode, the GaN-based trench metal oxide Schottky barrier diode from top to bottom comprises:
Dependencies are inferred from the claim text.