Electronic module, especially optical transceiver module

An electronic module, comprising

• (a) a casing, at least a portion (heat dissipating portion) of which consists of a thermally conductive material adapted to dissipate heat to a surrounding air or to a neighboring heat sink;
• (b) a printed circuit board provided within the casing, the printed circuit board carrying at least one heat producing electronic device on a mounting surface thereof;
• c) a table-like heat dissipating element having one or more legs extending from a table top is provided on the mounting surface, wherein the table top covers the at least one heat producing electronic device and wherein the one or more legs contact the mounting surface in an area surrounding the at least one heat producing electronic device, and
• (d) an upper surface of the table top either directly or indirectly contacts an inner surface of the heat dissipating portion of the casing, wherein the printed circuit board, the table-like heat dissipating element and the casing are designed in such a way that a major part of the heat produced by the at least one heat producing electronic device is dissipated via the printed circuit board and to the table top by way of the one or more legs of the table-like heat dissipating element to the heat dissipating portion of the casing.