Stripline wafer for wafer based connector system

A multilayer stripline wafer for use in an electrical connector, the multilayer stripline wafer comprising:

• a mating interface and an mounting interface;
• multiple layers;
• signal transmission pathways positioned in at least one internal layer of the multiple layers, the signal transmission pathways having signal conductive pads positioned proximate but spaced from the mating interface;
• conductive planar members positioned in one or more layers of the multiple layers;
• floating pads extending between the mating interface and the signal conductive pads, the floating pads do not physically engaged the signal conductive pads, the floating pads being capacitively coupled to an internal ground layer of the multilayer stripline wafer and a beam area of a mating contact.