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US 12,689,146 B2Granted
Connector with integrally molded resin portions of different materials
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorTetsuya Miyamura
Life of this patent
Estimating the term…
Abstract
It is aimed to provide a connector not requiring a dedicated assembling facility. A connector (10) is provided with a primary molding portion (20A) made of a primary resin material and a secondary molding portion (50A) made of a secondary resin material. The secondary molding portion (50A) is provided relatively movably with respect to the primary molding portion (20A).
Claims6
A connector, comprising:
- a primary molding portion made of a primary resin material;
- and
- a secondary molding portion made of a secondary resin material,
- wherein the secondary molding portion being provided relatively movably with respect to the primary molding portion,
- wherein the primary resin material and the secondary resin material being resin materials unbondable to each other so that the integrally molded primary molding portion and secondary molding portion are dividable,
- wherein the primary molding portion and the secondary molding portion are integrally molded together by two-color molding such that the primary molding portion and the secondary molding portion are separable from each other along a boundary surface, and
- wherein the primary molding portion includes a housing-side cavity having an open portion in a lower end thereof, the open portion forming the boundary surface between the housing-side cavity and the secondary molding portion.
4 more elements
Dependencies are inferred from the claim text.