Compact thin-film surface mountable coupler
AssigneeKYOCERA AVX Components Corporation
InventorsMichael Marek, Elinor O'Neill, Arie Leonid Talalaevsky, Nahum Bohmstein
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Abstract
A surface mountable thin-film coupler may include a monolithic base substrate and a plurality of ports formed over the monolithic base substrate. The surface mountable thin-film coupler may include at least one thin-film component connected with at least one port of the plurality of ports. The surface mountable thin-film coupler may provide a coupling factor that is greater than −5 dB and less than −1 dB over a coupling frequency range having a lower bound that is greater than 1 GHz and an upper bound that is at least 200 MHz greater than the lower bound. A footprint of the coupler may be less than about 3 mm2.
Claims32
A surface mountable thin-film coupler comprising:
- a monolithic base substrate;
- a plurality of ports formed over the monolithic base substrate;
- and
- at least one thin-film component connected with at least one port of the plurality of ports;
- wherein the surface mountable thin-film coupler provides a coupling factor that is greater than −5 dB and less than −1 dB across a coupling frequency range having a lower bound that is greater than 1 GHz and an upper bound that is at least 200 MHz greater than the lower bound, and
- wherein a footprint of the coupler is less than about 3 mm2.
A surface mountable thin-film coupler comprising:
- a monolithic base substrate;
- a plurality of ports formed over the monolithic base substrate, wherein the plurality of ports comprising an isolated port, a coupling port, an input port, and an output port;
- a first thin-film inductor connected between the input port and the output port;
- and
- a second thin-film inductor connected between the coupling port and the isolated port and inductively coupled with the first thin-film inductor
- wherein a footprint of the coupler is less than about 3 mm2.
A method for forming a surface mountable thin-film coupler, the method comprising:
- providing a monolithic base substrate;
- forming a plurality of ports over the monolithic base substrate, wherein the plurality of ports comprising an isolated port, a coupling port, an input port, and an output port;
- forming a first thin-film inductor connected between the input port and the output port;
- and
- forming a second thin-film inductor connected between the coupling port and the isolated port and inductively coupled with the first thin-film inductor, wherein a footprint of the coupler is less than about 3 mm2.
A power supply comprising:
- at least one amplifier;
- and
- at least one surface mountable thin-film coupler comprising:
- a monolithic base substrate;
- a plurality of ports formed over the monolithic base substrate;
- and
- at least one thin-film component connected with at least one port of the plurality of ports;
- wherein the surface mountable thin-film coupler provides a coupling factor that is greater than −5 dB and less than −1 dB across a coupling frequency range having a lower bound that is greater than 1 GHz and an upper bound that is at least 200 MHz greater than the lower bound, and
- wherein a footprint of the coupler is less than about 3 mm2.
Dependencies are inferred from the claim text.