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US 12,687,437 B2Granted
Electronic device including sensor module
AssigneeSamsung Electronics Co., Ltd.
InventorsHyunguk Yoo, Injo Jeong, Jeahyuck Lee, Seongwook Jo, Younghyun Kim, Seungwon Lee
Life of this patent
Estimating the term…
Abstract
An electronic device includes a housing including a first area provided to transmit light and a sensor hole formed in the first area. A circuit board is disposed inside the housing, a first sensor is connected to the circuit board, and a shield member is configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor. A conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.
Claims18
An electronic device comprising:
- a housing including a first area provided to transmit light and a sensor hole formed in the first area;
- a circuit board disposed inside the housing;
- a first sensor connected to the circuit board and disposed in at least a portion of the sensor hole;
- and
- a shield member configured to block the sensor hole and prevent foreign matter from being introduced through the sensor hole,
- wherein a conductive material for heat conduction is coated on an inner surface of the sensor hole.
3 more elements
An electronic device comprising:
- a housing including a first area provided to transmit light and a sensor hole formed in the first area;
- a circuit board disposed inside the housing;
- a first sensor electrically connected to the circuit board, the first sensor disposed in at least a portion of the sensor hole;
- a second sensor disposed to overlap the first area and including a light-emitting element and a light-receiving element;
- and
- a shield member configured to block the sensor hole and prevent foreign matter from being introduced through the sensor hole,
- wherein a conductive material for heat conduction is coated on an inner surface of the sensor hole.
4 more elements
Dependencies are inferred from the claim text.