US 12,686,938 B2Granted

Wafer holder and method

AssigneePoro Technologies Ltd

InventorsTongtong Zhu, Yingjun Liu

Life of this patent

Estimating the term…

Loading patent…

Abstract

A wafer holder for holding a semiconductor wafer during electrochemical porosification with an electrolyte includes a housing for receiving the semiconductor wafer, an aperture in the housing, through which an upper surface of the semiconductor wafer is exposable to the electrolyte, a seal extending around the aperture, for preventing the ingress of electrolyte into the housing; and an electrical contact for making an electrical connection with the semiconductor wafer. A method of electrochemical porosification of a semiconductor wafer includes placing a semiconductor wafer in the wafer holder; immersing the housing in an electrolyte, so that the surface of the semiconductor wafer is exposed to electrolyte through the aperture; and applying a potential difference between the semiconductor wafer and the electrolyte.

Claims23

Dependent claims

A wafer holder for holding a semiconductor wafer during electrochemical porosification with an electrolyte, the wafer holder comprising:

a housing for receiving the semiconductor wafer;
an aperture in the housing, through which an upper surface of the semiconductor wafer is exposable to the electrolyte;
a seal extending around the aperture, for preventing the ingress of electrolyte into the housing;
and
an electrical contact for making an electrical connection with the semiconductor wafer,
in which the housing comprises a backing section configured to contact a bottom surface of the semiconductor wafer, and a front section configured to contact the upper surface of the semiconductor wafer, the front section comprising the aperture, and in which the backing section comprises a resilient o-ring configured to support the semiconductor wafer when the semiconductor wafer is inserted into the housing.

3 more elements

Dependencies are inferred from the claim text.