Cleaning operations based on deposition thickness
AssigneeApplied Materials, Inc.
InventorsVictor Zamarian, Mitesh Harshad Sanghvi, Venkatanarayana Shankaramurthy, Yuhyuk Cho, Deepesh Rai
Life of this patent
Estimating the term…
Abstract
A method includes identifying deposition thickness property data associated with an amount of material deposited via one or more substrate processing operations of a process recipe performed in a processing chamber. The method further includes determining, based on the deposition thickness property data and a variable clean time relationship of the process recipe, cleaning operation parameters. The method further includes causing, based on the cleaning operation parameters, a cleaning operation in the processing chamber.
Claims20
A method comprising:
- identifying deposition thickness property data associated with an amount of material deposited via one or more semiconductor processing operations of a process recipe performed in a processing chamber;
- providing the deposition thickness property data as input to a variable cleaning relationship of the process recipe to determine cleaning operation parameters comprising two or more of cleaning intensity, cleaning temperature, or cleaning cycle quantity in the processing chamber, wherein the variable cleaning relationship comprises a function that outputs the cleaning operation parameters based on a current value of the deposition thickness property data;
- and
- causing, based on the cleaning operation parameters, a cleaning operation in the processing chamber.
A non-transitory computer-readable storage medium storing instructions which, when executed, cause a processing device to perform operations comprising:
- identifying deposition thickness property data associated with an amount of material deposited via one or more substrate processing operations of a process recipe performed in a processing chamber;
- providing the deposition thickness property data as input to a variable cleaning relationship of the process recipe to determine cleaning operation parameters comprising two or more of cleaning intensity, cleaning temperature, or cleaning cycle quantity in the processing chamber, wherein the variable cleaning relationship comprises a function that outputs the cleaning operation parameters based on a current value of the deposition thickness property data;
- and
- causing, based on the cleaning operation parameters, a cleaning operation in the processing chamber.
A system comprising:
- a memory;
- and
- a processing device coupled to the memory, the processing device to:
- identify deposition thickness property data associated with an amount of material deposited via one or more substrate processing operations of a process recipe performed in a processing chamber;
- provide the deposition thickness property data as input to a variable cleaning relationship of the process recipe to determine cleaning operation parameters comprising two or more of cleaning intensity, cleaning temperature, or cleaning cycle quantity in the processing chamber, wherein the variable cleaning relationship comprises a function that outputs the cleaning operation parameters based on a current value of the deposition thickness property data;
- and
- cause, based on the cleaning operation parameters, a cleaning operation in the processing chamber.
Dependencies are inferred from the claim text.