Cleaning apparatus and substrate processing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsSangjine Park, Ji Hwan Park
Life of this patent
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AssigneeSamsung Electronics Co., Ltd.
InventorsSangjine Park, Ji Hwan Park
Estimating the term…
Provided is a cleaning apparatus that includes a nozzle configured to spray cleaning liquid, a nozzle extension comprising a nozzle extension body having a first aperture and a second aperture connected by a fluid passage in the nozzle extension body, the first aperture aligned with the nozzle and the second aperture for discharging the cleaning liquid, and the first aperture and the second aperture each have a normal direction oblique to each other, and a cover that encloses the second aperture and that comprises a first cover portion configured to cover at least a portion of a front surface of a substrate, a second cover portion configured to cover at least a portion of a rear surface of the substrate, and a third cover portion configured to cover at least a portion of a side of the substrate edge, wherein the cover comprises a placement groove configured to receive the substrate edge.
A cleaning apparatus comprising:
A substrate processing apparatus comprising a cleaning apparatus configured to clean a substrate and a substrate support that maintains the substrate in a horizontal state,
A substrate processing apparatus comprising a cleaning apparatus for cleaning a substrate, a substrate support for supporting the substrate in a horizontal state, and a spray apparatus for spraying a spray liquid on the substrate,
Dependencies are inferred from the claim text.