Semiconductor packages having a coupling member including a vertical wire and a metal portion extending around the vertical wire

A semiconductor package comprising:

• a first redistribution layer substrate including a redistribution line and a redistribution via on the redistribution line;
• a bonding pad on the redistribution line and the redistribution via;
• a coupling member on the bonding pad;
• a semiconductor chip on the first redistribution layer substrate, wherein the semiconductor chip is spaced apart from the coupling member;
• a connection member that electrically connects the first redistribution layer substrate and the semiconductor chip;
• an encapsulant on the bonding pad, the coupling member, the connection member, and the semiconductor chip;
• and
• a second redistribution layer substrate on the encapsulant,
• wherein the coupling member includes a bonding wire and a metal portion extending around the bonding wire,
• wherein the bonding wire includes a compressed ball and a vertical wire stretched from the compressed ball, and
• wherein a first end of the coupling member is electrically connected to the bonding pad, and a second end of the coupling member is electrically connected to the second redistribution layer substrate.