Alignment pad of display panel and display device having the same
AssigneeSamsung Display Co., Ltd.
InventorsKyung-Mok Lee, Young Min Cho, Hyunwoo Lee
Life of this patent
Estimating the term…
Abstract
A display device includes a display area and a non-display area including a first driving pad portion at which a display panel is connected to an integrated circuit chip by a solder bump having a width. The first driving pad portion includes a first pad through which an electrical signal transmits between the first driving pad portion and the integrated circuit chip, and a second pad by which alignment between the first driving pad portion and the integrated circuit chip is determined. The second pad of the first driving pad portion includes a (2-1)-th pad having a width which is the same as the width of the solder bump and a (2-2)-th pad having a width which is larger than the width of the (2-1)-th pad.
Claims20
A display device comprising:
- a display panel including:
- a display area, and
- a non-display area including a first driving pad portion at which the display panel is connected to an integrated circuit chip by solder bumps of the integrated circuit chip, each of the solder bumps having a width,
- wherein
- the first driving pad portion includes:
- a first pad through which an electrical signal transmits between the first driving pad portion and the integrated circuit chip via a solder bump among the solder bumps;
- a second pad which is electrically floating and by which alignment between the first driving pad portion and the integrated circuit chip is determined;
- and
- the second pad of the first driving pad portion including:
- a (2-1)-th pad having a width which is the same as the width of the solder bump;
- and
- a (2-2)-th pad having a width which is larger than the width of the (2-1)-th pad;
- and
- the first pad, the (2-1)-th pad and the 2-2)-th pad respectively corresponding to the solder bumps of the integrated circuit.
A display device comprising:
- a display panel including:
- a display area, and
- a non-display area including a first driving pad portion at which the display panel is connected to an integrated circuit chip by solder bumps of the integrated circuit chip, each of the solder bumps having a width defining a width direction,
- wherein the first driving pad portion includes:
- a first pad through which an electrical signal transmits between the first driving pad portion and the integrated circuit chip via a solder bump among the solder bumps;
- a second pad which is electrically floating and by which alignment between the first driving pad portion and the integrated circuit chip is determined;
- and
- the second pad of the first driving pad portion including:
- a first area having a width along the width direction which is the same as the width of the solder bump;
- and
- a second area extending from the first area in a direction crossing the width direction, the second area having a width along the width direction which is larger than the width of the first area;
- and
- the first pad and the second pad respectively corresponding to the solder bumps of the integrated circuit.
Dependencies are inferred from the claim text.