Electrodes for microelectromechanical system microphones
AssigneesInvenSense, Inc., TDK Electronics Co., Ltd.
InventorsJoseph Seeger, Dennis Mortensen
Life of this patent
Estimating the term…
Loading patent…
AssigneesInvenSense, Inc., TDK Electronics Co., Ltd.
InventorsJoseph Seeger, Dennis Mortensen
Estimating the term…
The present invention relates to split electrodes for microelectromechanical system (MEMS) microphones. In one embodiment, a MEMS sensor includes a membrane, a membrane electrode formed in a portion of the membrane, and a backplate situated parallel to the membrane and separated by a gap. The backplate includes a first region of the backplate, where the first region of the backplate has first perforations of a first density, a backplate electrode is formed in a portion of the first region of the backplate, and a portion of the membrane electrode overlaps a portion of the backplate electrode in a sensing region forming a sensing capacitor, the sensing capacitor being configured to sense motion of the membrane in response to acoustic pressure. The backplate also includes a second region of the backplate having second perforations of a second density, where the second density is greater than the first density.
A microelectromechanical system (MEMS) sensor comprising:
A microelectromechanical system (MEMS) sensor comprising:
A microelectromechanical (MEMS) acoustic sensor comprising:
Dependencies are inferred from the claim text.