US 12,684,256 B2 · Thermal imaging camera module configured for integration into a host system

Abstract

Thermal cameras exist at price points and volume manufacturing suitable for practical consideration of integration of thermal camera modules into host electronic devices, including automobiles, PED's—smartphones, tablets, etc. However, individual thermal cameras require extensive unit-specific data to provision and operate each individual camera with acceptable performance. This along with non-standard electrical interfaces, are adoption barriers to host device manufacturers, for example, where some devices, including some PED's, have become bus-based platforms allowing for functional modules to be packaged into common PED's and operated by way of apps. Some modern PED's, for example, include standard high-speed data busses and low-speed control busses. Devices and methods are disclosed for delivering compatibility with standard internal interfaces and storing the camera module's unit-specific data in a memory element on the camera module. The data can be read out on the same data bus used for thermal camera image data, either by selection between stored data and video output or by simultaneous streaming on different virtual channels. In a particular embodiment the logic element may be configured to write per pixel runtime data such as bias voltages on a runtime per pixel basis to the FPA as the FPA operates by accessing the memory element from a starting point address, wherein the starting point address may be at least one of predetermined or set by a host controller, thereby allowing the FPA to operate without local processing resources or per pixel communication with the host controller.

Claims21

Dependent claims

A thermal camera module (TCM) interfaceable to a system including at least one controller and at least one data interface, the TCM comprising:

at least one focal plane array (FPA) comprising a detector array integrated with a read-out integrated circuit (ROIC), whose output is image frame data, comprising command and control input/outputs (I/O) and image frame data outputs;
at least one memory element loaded with data including at least one of provisioning and operational data for the FPA, wherein the at least one memory element comprises a QSPI memory element;
and
at least one control logic element, interfaced to FPA command and control registers, and image frame data output of the FPA, the at least one memory element, and the at least one data interface, wherein the at least one control logic element comprises a QSPI controller master;
wherein the control logic element is configured to, including in response to commands on the at least one data interface, enable read/write access to the at least one memory element, read/write access to ROIC control registers, and read access to FPA image frame data output.

2 more elements

A thermal camera module (TCM) interfaceable to a system including at least one controller and at least one data interface, the TCM comprising:

at least one focal plane array (FPA) comprising a detector array integrated with a read-out integrated circuit (ROIC), whose output is image frame data, comprising command and control input/outputs (I/O) and image frame data outputs;
at least one memory element loaded with data including at least one of provisioning and operational data for the FPA;
and
at least one control logic element, interfaced to FPA command and control registers, and image frame data output of the FPA, the at least one memory element, and the at least one data interface;
wherein the control logic element is configured to, including in response to commands on the at least one data interface, enable read/write access to the at least one memory element, read/write access to ROIC control registers, and read access to FPA image frame data output,
wherein the at least one data interface comprises at least two data interfaces, the at least two data interfaces comprising:
a low-speed data interface controller for low data rate applications including command and configuration data, wherein the low-speed data interface controller supports bidirectional communication with the control logic element, including one or more of the control logic element enabling low speed data comprising:
provisioning data from the memory element;
read and write data to the ROIC registers, including setting provisioning data into the ROIC registers;
operational data from the memory element on the high-speed data bus;
operational data for running the ROIC independent of per pixel communication of a data interface;
and
control commands to select acquisition of FPA video data on the high-speed data bus;
and
a high-speed data interface controller suitable for high data rate applications including video data,
wherein at least one of the high-speed and low-speed data interface controllers or the at least one memory element includes data integrity checking at least one of available as standard features in the data interface functionality or as a custom feature or features built into the data interface controllers.

13 more elements

Dependencies are inferred from the claim text.

Thermal imaging camera module configured for integration into a host system

Life of this patent

Thermal imaging camera module configured for integration into a host system

Life of this patent

Abstract

Claims21