Power conversion device having a control board retaining member

A power conversion device comprising:

• a plurality of power modules including semiconductor chips and arranged side by side, each power module being formed in a rectangular parallelepiped shape having a first surface, a second surface opposite to the first surface, and a third surface, a fourth surface, a fifth surface, and a sixth surface which are four surfaces surrounding the first surface and the second surface;
• a board which is placed at the second surfaces of the plurality of power modules with a space provided between the board and the second surfaces, and is electrically connected to module terminals that the plurality of power modules respectively have;
• a board retention member which is placed in the space between the board and the plurality of power modules and retains the board, the board retention member being made of a resin member having insulation property;
• a cooler having a cooling surface to which the first surfaces of the plurality of power modules are thermally connected;
• a housing having the cooler and having a placement surface on the same side as a side where the cooling surface is provided;
• and
• a film capacitor electrically connected to the plurality of power modules via a busbar, the film capacitor being adjacent to the plurality of power modules and thermally connected to the placement surface of the housing, wherein
• the plurality of power modules are arranged side by side in a direction parallel to the third surfaces,
• each module terminal protrudes from at least one of the second surface of the power module, the third surface of the power module, and the fourth surface opposite to the third surface, and then extends toward the board,
• a part of the module terminal extending toward the board penetrates a through hole that the board retention member has,
• the placement surface has a boss fixed portion to which a fixation boss that the board retention member has is fixed, and
• the boss fixed portion is provided at a part of the placement surface other than the cooling surface and a projected part of the placement surface where the film capacitor and the busbar are projected on the placement surface.