Smart card inlay element

InterConnect (ICT) element for electrically connecting a first end section of a first wire and a second end section of a second wire with an anode and with a cathode of an OLED panel, comprising

• an insulating substrate,
• a first connection pad for receiving the first end section of the first wire and a second connection pad for receiving the second end section of the second wire, the first connection pad and the second connection pad being provided on a top surface of the insulating substrate,
• a first connection element for connecting to the anode of the OLED panel and a second connection element for connecting to the cathode of the OLED panel, the first connection element and the second connection element being provided on an upper surface of the insulating substrate,
• a rectifier assembly, being electrically connected between the first connection pad, the second connection pad, the first connection element and the second connection element, for connecting to the cathode of the OLED panel, wherein the rectifier assembly comprising conductive traces both on the upper surface and on a lower surface of the insulating substrate.

Method of manufacturing an inlay elements sheet for making smart cards, comprising the steps:

• providing an antenna layer plastic sheet with a plurality of antenna layers and with a plurality of cut-out sections for receiving OLED modules, COB contactless chip modules and/or COB capacitor modules,
• applying an adhesive tape layer at a bottom surface of the antenna layer plastic sheet, at least partly covering the plurality of cut-out sections,
• providing the OLED modules, the COB contactless chip modules and/or the COB capacitor modules in the cut-out sections in the antenna layer plastic sheet,
• providing a plurality of first antenna coils on the antenna layer plastic sheet;
• and
• connecting the COB contactless chip modules and/or the COB capacitor modules with the respective first antenna coils,
• providing a plurality of second antenna coils on the antenna layer plastic sheet, and connecting the OLED modules with the respective second antenna coils,
• providing a first compensation layer plastic sheet with a plurality of cutout sections for the OLED modules, for the COB contactless chip modules and/or for the COB capacitor modules and arranging the first compensation layer plastic sheet on a top surface of the antenna layer plastic sheet, such that the OLED modules, the COB contactless chip modules and/or the COB capacitor modules fit into the respective cut-out sections in the first compensation layer plastic sheet,
• providing a first overlay layer plastic sheet on the bottom surface of the antenna layer plastic sheet,
• providing a second overlay layer plastic sheet on a top surface of the first compensation layer plastic sheet, and
• collating and laminating of the antenna layer plastic sheet, the first compensation layer plastic sheet, the first overlay layer plastic sheet, and the second overlay layer plastic sheet while applying heat and/or pressure.