Photoresist compositions for EUV and methods for manufacturing semiconductor devices using the same

A photoresist composition for EUV comprising:

• a photosensitive resin;
• a photoacid generator;
• a photo-decomposable quencher;
• and
• an additive,
• wherein the additive comprises a copolymer including a first repeating unit and a second repeating unit, wherein the first repeating unit has a structure of Chemical formula 1-2
• wherein Rf2 is a fluoroalkyl group or is a hydrocarbon group substituted with one or more fluoroalkyl group(s);
• and
• wherein the second repeating unit has a structure of Chemical formula 2
• wherein R2 is a hydrogen atom, a methyl group, or a trifluoromethyl group, and
• Rb is a single bond, a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, a substituted or unsubstituted arylene group having 6 to 18 carbon atoms, a substituted or unsubstituted arylalkylene group having 6 to 18 carbon atoms, or a substituted or unsubstituted alkylarylene group having 6 to 18 carbon atoms.

A method for manufacturing a semiconductor device, the method comprising:

• forming a target film on a substrate;
• forming a photoresist film on the target film;
• performing an exposure process on the photoresist film;
• performing a developing process on the photoresist film to form a photoresist pattern;
• and
• performing an etching process on the target film using the photoresist pattern as an etching mask,
• wherein the photoresist film comprises a photosensitive resin, a photoacid generator, and an additive, and
• wherein the additive comprises a copolymer including a first repeating unit and a second repeating unit, wherein the first repeating unit has a structure of Chemical formula 1-1
• wherein R1 is a hydrogen atom, a hydroxy group, or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, and Rf is a fluoroalkyl group or a hydrocarbon group substituted with one or more fluoroalkyl group(s);
• and
• wherein the second repeating unit has a structure of Chemical formula 2
• wherein R2 is a hydrogen atom, a hydroxy group, or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, and
• Rb is a single bond, a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, a substituted or unsubstituted arylene group having 6 to 18 carbon atoms, a substituted or unsubstituted arylalkylene group having 6 to 18 carbon atoms, or a substituted or unsubstituted alkylarylene group having 6 to 18 carbon atoms.