Electro-optic modulator, optical chip, and integrated chip
AssigneeHuawei Technologies Co., Ltd.
InventorsHongmin Chen, Mengdie Sun, Xin Chen, Fusheng Tang, Haifeng Shao, Lei Zhao, Lei Liu
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AssigneeHuawei Technologies Co., Ltd.
InventorsHongmin Chen, Mengdie Sun, Xin Chen, Fusheng Tang, Haifeng Shao, Lei Zhao, Lei Liu
Estimating the term…
An electro-optic modulator is disposed on a surface of a substrate including: an optical waveguide layer disposed on the substrate, a modulation electrode disposed on the optical waveguide layer, and a metal electrode disposed on the modulation electrode and electrically connected to the modulation electrode. A first end of the metal electrode is coupled to a radio frequency driver, and receives a modulation signal input by the radio frequency driver. The modulation electrode is configured to perform electro-optic modulation on the optical waveguide layer based on the modulation signal. A second end of the metal electrode is coupled to a direct-current voltage end, and the direct-current voltage end is configured to input a voltage signal and provide a bias voltage for the radio frequency driver by using the metal electrode. This reduces costs and a size of the electro-optic modulator, and is conducive to device miniaturization.
An electro-optic modulator disposed on a surface of a substrate, the electro-optic modulator comprising:
An optical chip comprising:
An integrated chip comprising:
Dependencies are inferred from the claim text.