Thermal management of pluggable optical transceiver
AssigneeInfinera Corporation
InventorFranklin Wall, Jr.
Life of this patent
Estimating the term…
Abstract
Systems and devices for providing heat relief to an optical transceiver device are disclosed. The optical transceiver device includes a heat transfer structure that includes a heat slug connected to a high heat generating circuit in the optical transceiver device. The heat slug has a structure that allows heat to flow anisotropically from one surface of the heat slug that contacts the heat generating circuit to a second surface of the heat slug that is thermally coupled to a heat transfer device such as a heat sink. The perimeter of the heat slug is enclosed by an insulation frame. The insulation frame is configured to thermally isolate the heat slug by reducing heat transfer from the heat slug to other components of the optical transceiver device.
Claims29
An apparatus comprising:
- a plurality of circuit regions comprising a first circuit region and a second circuit region operable to generate more heat than the first circuit region;
- a heat slug disposed above the second circuit region, the heat slug extending from the second circuit region to an exterior surface of the apparatus;
- and
- an insulation frame surrounding the heat slug adjacent to the exterior surface of the apparatus and configured to reduce heat transfer from the heat slug and second circuit region to the first circuit region, wherein
- the insulation frame comprises:
- a first portion disposed at a surface of the insulation frame;
- and
- a second portion disposed underneath the first portion and separated from the first portion by a gap;
- and
- the heat slug comprises a tab configured to be inserted into the gap and be affixed to the insulation frame, a top surface of the tab directly contacting the first portion and a bottom surface of the tab directly contacting the second portion.
A system comprising:
- an optical transceiver device comprising:
- a plurality of circuit regions;
- a heat slug disposed above one of the plurality of circuit regions, the heat slug extending from the one of the plurality of circuit regions to an exterior surface of the optical transceiver device;
- and
- an insulation frame surrounding the heat slug adjacent to the exterior surface of the optical transceiver device and configured to insulate heat from the heat slug;
- and
- a heat transfer device directly contacting the heat slug and configured to reduce heat transfer from the heat slug and saki one of the plurality of circuit regions to other circuit regions of the plurality of circuit regions, wherein the insulation frame comprises:
- a first portion disposed at a surface of the insulation frame;
- and
- a second portion disposed underneath the first portion and separated from the first portion by a gap;
- and
- the heat slug comprises a tab configured to be inserted into the qap and be affixed to the insulation frame, a top surface of the tab directly contacting the first portion and a bottom surface of the tab directly contacting the second portion.
A system, comprising:
- an optical transceiver device comprising:
- a plurality of circuit regions;
- a heat slug disposed above one of the plurality of circuit regions, the heat slug extending from the one of the plurality of circuit regions to an exterior surface of the optical transceiver device;
- and
- an insulation frame surrounding the heat slug adjacent to the exterior surface of the optical transceiver device and configured to insulate heat from the heat slug;
- and
- a heat transfer device directly contacting the heat slug and configured to reduce heat transfer from the heat slug and said one of the circuit regions to other circuit regions of the plurality of circuit regions,
- wherein:
- the optical transceiver device comprises a housing configured to accommodate the plurality of circuit regions, the heat slug, and the insulation frame;
- and
- a surface of the heat slug is flush with a surface of the housing.
A quad small form factor pluggable double density device (QSFP-DD) coupled to a heat sink, the QSFP-DD comprising:
- a heat slug disposed above a digital signal processing circuit, the heat slug extending from the digital signal processing circuit to an exterior surface of the QSFP-DD and contacting the heat sink, the heat slug comprising a tab;
- and
- an insulation frame surrounding the heat slug adjacent to the exterior surface of the QSFP-DD and configured to thermally isolate the heat slug, a surface of the insulation frame is recessed from a surface of the heat slug, wherein the insulation frame comprises:
- a first portion disposed at the surface of the insulation frame;
- and
- a second portion disposed underneath the first portion and separated from the first portion by a gap, wherein the gap is filled by the tab such that a top surface of the tab directly contacts the first portion and a bottom surface of the tab directly contacts the second portion.
Dependencies are inferred from the claim text.