Photonic alignment device and method

A semiconductor device, comprising:

• a photonic die coupled to a substrate, the photonic die having an optical port;
• an electronic die coupled to the substrate and electrically connected to the photonic die;
• an optical fiber having an end adjacent to the optical port;
• an optical coupler located between the optical fiber and the optical port, the optical coupler including a transparent material having a first index of refraction;
• a beam path through the transparent material of the optical coupler;
• and
• one or more correction regions along the beam path, the one or more correction regions having a second index of refraction different than the first index of refraction wherein the second index of refraction is capable of being modified in the semiconductor device to increase coupling efficiency between the optical fiber and the optical port.

A method of forming a semiconductor device, comprising:

• placing an optical fiber adjacent to an optical port of a photonic die;
• placing an optical coupler between the optical fiber and the optical port;
• and
• after placing the optical fiber and the optical coupler, forming one or more correction regions between a first end and a second end of the optical coupler to modify a beam path between the optical port and the optical fiber.