Methods for reducing vibration of semiconductor manufacturing apparatuses and semiconductor manufacturing apparatuses
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Chen Ho, Chih Ping Liao, Chien Ting Lin, Jie-Ying Yang, Wei-Ming Wang, Ker-Hsun Liao, Chi-Hsun Lin
Life of this patent
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Abstract
A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.
Claims20
A method, comprising:
- measuring a vibration associated with an operation of a semiconductor manufacturing apparatus,
- determining a first source of the vibration,
- coupling a first weight to a first external surface of the apparatus proximate to the first source of the vibration,
- remeasuring the vibration, and
- when the remeasured vibration is above an acceptable level, coupling an additional weight to the first weight on the first external surface of the apparatus, wherein the first weight includes an attachment part configured to receive and retain the additional weight.
A method, comprising:
- measuring a vibration associated with an operation of a semiconductor manufacturing apparatus,
- determining a source of the vibration,
- coupling a plurality of weights at different locations on an exterior of the apparatus to provide a balanced distribution of the plurality of weights,
- remeasuring the vibration, and
- when the remeasured vibration is above an acceptable level, coupling additional weights to the plurality of weights at the different locations on the exterior of the apparatus, wherein the plurality of weights include attachment parts configured to receive and retain the additional weights.
A semiconductor manufacturing apparatus, comprising:
- external surfaces;
- and
- a plurality of weights attached to balanced locations on the external surfaces, wherein the plurality of weights are configured to maximize a reduction in vibration of the semiconductor manufacturing apparatus, and the plurality of weights attached to the external surfaces include structures configured to receive and retain additional weights.
Dependencies are inferred from the claim text.